规格书 |
|
类型 |
Card Edge |
间距 |
1.27 mm |
触点数 |
40 |
触点电镀 |
Gold |
安装 |
Through Hole |
端接方式 |
Press Fit |
标准包装 |
Rail / Tube |
评论 |
Designed to accept multi-layer daughter boards. |
RoHSELV合规性 |
RoHS/Not ELV Compliant |
Lead Free Solder Processes |
Not relevant for lead free process |
间距(mm (中) ) |
1.27 [0.050] |
端子尾部电镀 |
Tin-Lead |
联系侵 |
Palladium Nickel |
PCB端接类型 |
Press-Fit |
外壳材料 |
High Temperature Thermoplastic |
终止(焊接)长度(毫米) |
3.51 â 3.76 [0.138 â 0.148] |
外壳颜色 |
Black |
触点区域镀层材料 |
Gold |
双位置数 |
20 |
触点材料 |
Beryllium Copper |
RoHSELV符合记录 |
Always was RoHS not ELV compliant |
Daughter Board Thickness (mm (in)) |
2.36 [0.093] |
RoHS |
RoHS Compliant |
标准包装 |
18 |